Raised solder-mask-defined (SMD) solder ball pads for a...

Details Raised solder-mask-defined (SMD) solder ball pads for a... Raised solder-mask-defined (SMD) solder ball pads for a...

2007-11-13

2007-11-13

McPherson, John A. (Department: 1756)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

C257S738000, C257S780000, C257S781000

Reexamination Certificate

active

10715641

ABSTRACT:
A raised solder-mask-defined (SMD) pad configured for receiving a solder ball on a laminate electronic circuit board and a method of creating the raised SMD pad on a laminate electronic circuit board. The method may comprise forming a base bump, covering the base bump with a conductive bump layer and layering a surrounding material over an extended edge of the conductive bump layer. The surrounding material is patterned to expose a pad face and of a portion of the sides of the conductive bump layer, such that the pad face is disposed above the surface of the surrounding material. The surrounding material may be patterned by a photolithography operation or alternatively, a laser-drill operation.

REFERENCES:
patent: 6762503 (2004-07-01), Lee
patent: 2002/0173075 (2002-11-01), Tie et al.

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