4. Electricity: conductors and insulators
  5. Boxes and housings
  6. Hermetic sealed envelope type

Manjula N. Variyam

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Method and system for chip-to-package interconnection

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Polymer-embedded solder bumps for reliable plastic package...

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate

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Raised solder-mask-defined (SMD) solder ball pads for a...

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Reexamination Certificate

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Wire bonding simulation

Data processing: structural design – modeling – simulation – and em – Simulating electronic device or electrical system
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2743934

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