Radiation sensitive resin composition

Details Radiation sensitive resin composition Radiation sensitive resin composition

1998-06-03

2000-04-11

Hamilton, Cynthia

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

430 18, 430313, 430314, 430315, 430318, 430935, 522 63, 522110, G03F 7038, G03F 7004, G03F 716, G03F 740

Patent

active

06048666&

ABSTRACT:
A radiation sensitive resin composition comprising an alkali-soluble resin such as a polyvinyl phenol or a phenol resin other than a polyvinyl phenol having a weight average molecular weight of 2,000 or higher, a cross-linking agent such as an amino resin having two or more active methylol groups in a molecule, a particulate rubbery material comprising a cross-linked polymer chemically modified with an epoxy compound, a liquid rubbery material having a number average molecular weight between 1,000 and 10,000 and a glass transition temperature of -20.degree. C. or lower, and a radiation polymerization initiator. The composition is best suited for use as a material for preparing an insulating layer interposed between two layers of conductive wiring that are arranged in an overlaying stack.

REFERENCES:
patent: 3825430 (1974-07-01), Kurka
patent: 5073477 (1991-12-01), Kusuda et al.
patent: 5262280 (1993-11-01), Knudsen et al.
patent: 5372913 (1994-12-01), Nanpei et al.
patent: 5688598 (1997-11-01), Keck et al.
patent: 5830621 (1998-11-01), Suzuki et al.
Elf-altochem from http:///www.Elf-atochem.com
ew elf/functional/polybd.html. 2 pages Jul. 13, 1999.

Affiliated with

Also associated with

Rating

Radiation sensitive resin composition does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Radiation sensitive resin composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Radiation sensitive resin composition will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1175253