Radially staggered bond pad arrangements for integrated circuit

Details Radially staggered bond pad arrangements for integrated circuit Radially staggered bond pad arrangements for integrated circuit

1995-05-26

1998-10-06

Fahmy, Wael

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Configuration or pattern of bonds

257203, 257208, 257779, H01L 2348, H01L 2352, H01L 2940

Patent

active

058181148

ABSTRACT:
The present invention provides a novel I/O pad structure and layout methodology which allows the effective wire bonding pitch to be reduced by circumventing the usual constraints of wire bonding technology. The bonding pad layout of the present invention entails the use of two rows of pads on the chip periphery as opposed to the more conventional single row, in-line arrangement. The bonding pads are arranged in a novel way, by radial staggering, to ensure no overlapping of bonding wire trajectories, even when conventional lead frames are used for the package. Comparing the radially staggered arrangement of the bonding pads of the present invention to convention single row, in-line bonding pad configuration, in the radially staggered arrangement every other pad is moved inward in the radial direction to form a second row. The radial direction used is from a projection point, typically the die center, and is dependent on the I/O circuitry height and the total number of pins of the package. The radially staggered bonding pad configuration allows uniform placement of wire trajectories despite the geometric fan-out from the die bonding pads to the lead frame bonding fingers.

REFERENCES:
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patent: 5235209 (1993-08-01), Shimizu et al.
patent: 5245214 (1993-09-01), Simpson
patent: 5252854 (1993-10-01), Arita et al.
patent: 5329143 (1994-07-01), Chan et al.
patent: 5359227 (1994-10-01), Liang et al.
patent: 5491364 (1996-02-01), Brandenburg et al.

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