4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Encapsulating

Frieder Haag

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Component assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Electronic device

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
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Lead frame device and method for producing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
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Method for joining a silicon plate to a second plate

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
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Method for manufacturing a pressure sensor

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
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Profile ID: LFUS-PAI-P-2130398

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