Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering
Reexamination Certificate
2006-06-23
2010-10-19
McDonald, Rodney G (Department: 1795)
Chemistry: electrical and wave energy
Apparatus
Coating, forming or etching by sputtering
C204S298080, C204S298110, C204S298120, C204S298190, C204S298200
Reexamination Certificate
active
07815782
ABSTRACT:
A physical vapor deposition target assembly is configured to isolate a target-bonding layer from a processing region. In one embodiment, the target assembly comprises a backing plate, a target having a first surface and a second surface, and a bonding layer disposed between the backing plate and the second surface. The first surface of the target is in fluid contact with a processing region and the second surface of the target is oriented toward the backing plate. The target assembly may include multiple targets.
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Chen Jrjyan Jerry
Hosokawa Akihiro
Inagawa Makoto
Le Hienminh Huu
Stimson Bradley O.
Applied Materials Inc.
McDonald Rodney G
Patterson & Sheridan LLP
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