PVD sputter system having nonplanar target configuration and met

Details PVD sputter system having nonplanar target configuration and met PVD sputter system having nonplanar target configuration and met

1995-06-01

1996-12-03

Weisstuch, Aaron

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

20429812, C23C 1434

Patent

active

055804284

ABSTRACT:
A PVD sputter system having a nonplanar target surface is disclosed. The configuration of the nonplanar target surface is adjusted to provide improved uniformity in deposition film thickness and step coverage at the peripheral boundary regions of the substrate. Emission-inducing power is distributed independently to different portions of the nonplanar target surface so as to modify the deposition profile according to substrate size and other factors.

REFERENCES:
patent: 4604180 (1986-08-01), Hirukawa et al.
patent: 4606806 (1986-08-01), Helmer
patent: 4747926 (1988-05-01), Shimizu et al.
patent: 4957605 (1990-09-01), Hurwitt et al.

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