PVD sputter system having nonplanar target configuration and met

Details PVD sputter system having nonplanar target configuration and met PVD sputter system having nonplanar target configuration and met

1994-09-30

1996-09-17

Weisstuch, Aaron

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

20429808, 20429812, C23C 1434

Patent

active

055565255

ABSTRACT:
A PVD sputter system having a nonplanar target surface is disclosed. The configuration of the nonplanar target surface is adjusted to provide improved uniformity in deposition film thickness and step coverage at the peripheral boundary regions of the substrate. Emission-inducing power is distributed independently to different portions of the nonplanar target surface so as to modify the deposition profile according to substrate size and other factors.

REFERENCES:
patent: 3654110 (1972-04-01), Kraus
patent: 3669871 (1972-06-01), Elmgren et al.
patent: 3988232 (1976-10-01), Wasa et al.
patent: 4595482 (1986-06-01), Mintz
patent: 4604180 (1986-08-01), Hirukawa et al.
patent: 4606806 (1986-08-01), Helmer
patent: 4747926 (1988-05-01), Shimizu et al.
patent: 4834856 (1989-05-01), Wehner
patent: 4956070 (1990-09-01), Nakada et al.
patent: 4957605 (1990-09-01), Hurwitt et al.
D. S. Bang et al., Modeling of Ti Physical Vapor Deposition Systems, IEEE International Workshop on Numerical Modeling of Processes and Devices for Integrated Circuits (NUPAD V, Honolulu) Jun. 1994, pp. 41-44.
D. S. Bang et al., Profile Modeling of Collimated Ti Physical Vapor Deposition, 10th Symposium on Plasma Processing, Electro Chemical Society, San Francisco, May 1994.

Affiliated with

Also associated with

Rating

PVD sputter system having nonplanar target configuration and met does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with PVD sputter system having nonplanar target configuration and met, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and PVD sputter system having nonplanar target configuration and met will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-410989