Purge gas in wafer coating area selection

Coating apparatus – Gas or vapor deposition – Work support

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Details

118715, 118725, C23C 1600

Patent

active

054475708

ABSTRACT:
Apparatus including a support and purge gas supply prevents edge and backside coating on a wafer in manufacture of integrated circuits. Various enclosure elements and methods are disclosed for containing and directing purge gas, and a CVD system is provided incorporating the elements of the invention.

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patent: 4801352 (1989-01-01), Piwczyk
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patent: 4990374 (1991-02-01), Keeley
patent: 5000113 (1991-03-01), Wang
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patent: 5133284 (1992-07-01), Thomas
patent: 5230741 (1993-07-01), van de Ven
Winkler, "Novellas Enters Tungsten CVD" Electronics News, Sep. 17, 1990.
Solid State Technology, "Tungsten Exclusion Ring Controls Deposition Area", p. 30, Aug. 1991.

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