Coating apparatus – Gas or vapor deposition – Work support
Patent
1992-06-23
1995-09-05
Bueker, Richard
Coating apparatus
Gas or vapor deposition
Work support
118715, 118725, C23C 1600
Patent
active
054475708
ABSTRACT:
Apparatus including a support and purge gas supply prevents edge and backside coating on a wafer in manufacture of integrated circuits. Various enclosure elements and methods are disclosed for containing and directing purge gas, and a CVD system is provided incorporating the elements of the invention.
REFERENCES:
patent: 4457359 (1984-07-01), Holden
patent: 4724621 (1988-02-01), Hobson
patent: 4801352 (1989-01-01), Piwczyk
patent: 4911103 (1990-03-01), Davis
patent: 4990374 (1991-02-01), Keeley
patent: 5000113 (1991-03-01), Wang
patent: 5033407 (1991-07-01), Mizuno
patent: 5094885 (1992-03-01), Selbrede
patent: 5133284 (1992-07-01), Thomas
patent: 5230741 (1993-07-01), van de Ven
Winkler, "Novellas Enters Tungsten CVD" Electronics News, Sep. 17, 1990.
Solid State Technology, "Tungsten Exclusion Ring Controls Deposition Area", p. 30, Aug. 1991.
Chow Raymond L.
Kang Sien G.
Schmitz Johannes J.
Scholz Frederick J.
Selbrede Steven C.
Boys Donald R.
Bueker Richard
Genus Inc.
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