Pulsed excitation of inductively coupled plasma sources

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – Having glow discharge electrode gas energizing means

Reexamination Certificate

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C156S345480, C118S7230AN, C118S7230IR, C315S111410

Reexamination Certificate

active

07115185

ABSTRACT:
The reaction rate of a feed gas flowed into a plasma chamber is controlled. In one embodiment a pulsed power supply repeatedly applies a high power pulse to the plasma chamber to increase the reaction rate of plasma within the chamber, and applies a low power pulse between applications of the high power pulses.

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patent: 2004/0121603 (2004-06-01), Chiu et al.

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