Proximity sensitive defect monitor

Details Proximity sensitive defect monitor Proximity sensitive defect monitor

2007-02-13

2007-02-13

Hirshfeld, Andrew H. (Department: 2858)

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

C324S765010

Reexamination Certificate

active

11164555

ABSTRACT:
The invention relates to a method for determining processing image induced defects in the manufacture of semiconductor products such as wafers by analyzing the circuit design of the product mask and modifying a conventional test defect structure to mimic the product mask to incorporate one or more isolated or other features including product mask circuit features likely to cause processing image induced defects into the test defect structure.

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Semiconductor Product Yield Analysis Test Site; N.E. Hallas, R.F. Levine and C.H. Scriyner; IBM Technical Disclosure Bulletin, vol. 20, No. 8, Jan. 1978, p. 3099-3100.

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