Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With heating or cooling means for apparatus part other than...
Reexamination Certificate
2004-03-31
2011-11-22
MacArthur, Sylvia R. (Department: 1716)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With heating or cooling means for apparatus part other than...
C392S416000, C219S390000, C156S345170, C134S106000
Reexamination Certificate
active
08062471
ABSTRACT:
Provided is an apparatus and a method for heating fluid in a proximity head. A fluid source supplies fluid to a channel within the proximity head. The fluid flows in the channel, through the proximity head, to an outlet port located on a bottom surface of the proximity head. Further, within the proximity head is a heating portion that heats the fluid. Various methods can heat the fluid in the heating portion. For example, the fluid can be heated via resistive heating and heat exchange. However, any mechanism for heating fluid in the proximity head is possible. After heating the fluid, the proximity head delivers the heated fluid through the outlet port to a surface of a semiconductor wafer. An inlet port proximately disposed near the outlet port vacuums the heated fluid to remove the heated fluid from the surface of the semiconductor wafer.
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deLarios John
Mikhaylichenko Katrina
LAM Research Corporation
MacArthur Sylvia R.
Martine Penilla Group LLP
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