Programmable via structure for three dimensional integration...

Static information storage and retrieval – Systems using particular element – Resistive

Reexamination Certificate

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C365S163000, C257S002000, C257S003000

Reexamination Certificate

active

07545667

ABSTRACT:
A programmable link structure for use in three dimensional integration (3DI) semiconductor devices includes a via filled at least in part with a phase change material (PCM) and a heating device proximate the PCM. The heating device is configured to switch the conductivity of a transformable portion of the PCM between a lower resistance crystalline state and a higher resistance amorphous state. Thereby, the via defines a programmable link between an input connection located at one end thereof and an output connection located at another end thereof.

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