Electronic digital logic circuitry – Multifunctional or programmable – Having details of setting or programming of interconnections...
Reexamination Certificate
2009-01-22
2010-11-23
Le, Don P (Department: 2819)
Electronic digital logic circuitry
Multifunctional or programmable
Having details of setting or programming of interconnections...
C326S041000
Reexamination Certificate
active
07839163
ABSTRACT:
Through silicon vias (TSVs) in silicon chips are both programmable and non-programmable. The programmable TSVs may employ metal/insulator/metal structures to switch from an open to shorted condition with programming carried out by complementary circuitry on two adjacent chips in a multi-story chip stack.
REFERENCES:
patent: 5965270 (1999-10-01), Fang et al.
patent: 6400008 (2002-06-01), Farnworth
patent: 6979880 (2005-12-01), Bhattacharyya et al.
patent: 7317256 (2008-01-01), Williams et al.
patent: 7402463 (2008-07-01), Yang et al.
patent: 2008/0073747 (2008-03-01), Chao et al.
patent: 2008/0079121 (2008-04-01), Han
Feng Kai Di
Hsu Louis Lu-Chen
Wang Ping-Chuan
Yang Zhijian
Brown Katherine S.
International Business Machines - Corporation
Jaklitsch Lisa U
Jordan John A.
Le Don P
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