Programmable multi-chip module

Electronic digital logic circuitry – Significant integrated structure – layout – or layout...

Reexamination Certificate

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C326S041000, C326S047000

Reexamination Certificate

active

07095253

ABSTRACT:
A multi-chip module comprising: a first IC having a first column of tiles, where each tile includes programmable logic; a second IC having a second column of tiles, where the second column is aligned with the first column; and a carrier die having signal lines, where a tile in the first column is directly connected to a tile in the second column via one of the signal lines.

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Ivo Dobbelaere et al.; “Field Programmable MCM systems—Design of an Interconnection Frame”; FPGA '92—First International ACM/SIGDA Workshop on Field Programmable Gate Arrays; Sponsored by ACM Special Interest Group on Design Automation (SIGDA); pp. 52-56.

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