Programmable connector/isolator and double polysilicon layer...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S280000, C438S096000

Reexamination Certificate

active

06893916

ABSTRACT:
An integrated circuit structure for MOS-type devices including a silicon substrate of a first conductivity type; a first gate insulating regions selectively placed over the silicon substrate of the first conductivity tape; a first polycrystalline silicon layer selectively placed over the silicon substrate of the first conductivity type; a second gate insulating regions selectively placed over the first gate insulating regions and the first polycrystalline silicon layer; a second polycrystalline silicon layer selectively placed over the second gate insulating regions; first buried silicon regions of a second conductivity type, buried within the silicon substrate of the first conductivity type, placed under the first polycrystalline silicon layer and in contact therewith; and second buried silicon regions of the second conductivity type, buried within the silicon substrate of the first conductivity type, placed under the second gate insulating regions, under the second polycrystalline silicon layer and insulated therefrom.

REFERENCES:
patent: 3673471 (1972-06-01), Klein et al.
patent: 3946426 (1976-03-01), Sanders
patent: 4017888 (1977-04-01), Christie et al.
patent: 4101344 (1978-07-01), Kooi et al.
patent: 4139864 (1979-02-01), Schulman
patent: 4164461 (1979-08-01), Schilling
patent: 4196443 (1980-04-01), Dingwall
patent: 4267578 (1981-05-01), Vetter
patent: 4291391 (1981-09-01), Chatterjee et al.
patent: 4295897 (1981-10-01), Tubbs et al.
patent: 4314268 (1982-02-01), Yoshioka et al.
patent: 4317273 (1982-03-01), Guterman et al.
patent: 4322736 (1982-03-01), Sasaki et al.
patent: 4374454 (1983-02-01), Jochems
patent: 4409434 (1983-10-01), Basset et al.
patent: 4435895 (1984-03-01), Parrillo
patent: 4471376 (1984-09-01), Morcom et al.
patent: 4581628 (1986-04-01), Miyauchi et al.
patent: 4583011 (1986-04-01), Pechar
patent: 4603381 (1986-07-01), Guttag et al.
patent: 4623255 (1986-11-01), Suszko
patent: 4727493 (1988-02-01), Taylor, Sr.
patent: 4766516 (1988-08-01), Ozdemir et al.
patent: 4799096 (1989-01-01), Koeppe
patent: 4821085 (1989-04-01), Haken et al.
patent: 4830974 (1989-05-01), Chang et al.
patent: 4939567 (1990-07-01), Kenney
patent: 4962484 (1990-10-01), Takeshima et al.
patent: 4975756 (1990-12-01), Haken et al.
patent: 4998151 (1991-03-01), Korman et al.
patent: 5030796 (1991-07-01), Swanson et al.
patent: 5050123 (1991-09-01), Castro
patent: 5061978 (1991-10-01), Mizutani et al.
patent: 5065208 (1991-11-01), Shah et al.
patent: 5068697 (1991-11-01), Noda et al.
patent: 5070378 (1991-12-01), Yamagata
patent: 5101121 (1992-03-01), Sourgen
patent: 5117276 (1992-05-01), Thomas et al.
patent: 5121089 (1992-06-01), Larson et al.
patent: 5121186 (1992-06-01), Wong et al.
patent: 5132571 (1992-07-01), McCollum et al.
patent: 5138197 (1992-08-01), Kuwana
patent: 5146117 (1992-09-01), Larson
patent: 5168340 (1992-12-01), Nishimura
patent: 5177589 (1993-01-01), Kobayashi et al.
patent: 5202591 (1993-04-01), Walden
patent: 5225699 (1993-07-01), Nakamura
patent: 5227649 (1993-07-01), Chapman
patent: 5231299 (1993-07-01), Ning et al.
patent: 5302539 (1994-04-01), Haken et al.
patent: 5308682 (1994-05-01), Morikawa
patent: 5309015 (1994-05-01), Kuwata et al.
patent: 5317197 (1994-05-01), Roberts
patent: 5336624 (1994-08-01), Walden
patent: 5341013 (1994-08-01), Koyanagi et al.
patent: 5345105 (1994-09-01), Sun et al.
patent: 5354704 (1994-10-01), Yang et al.
patent: 5369299 (1994-11-01), Byrne et al.
patent: 5371390 (1994-12-01), Mohsen
patent: 5376577 (1994-12-01), Roberts et al.
patent: 5384472 (1995-01-01), Yin
patent: 5384475 (1995-01-01), Yahata
patent: 5399441 (1995-03-01), Bearinger et al.
patent: 5404040 (1995-04-01), Hshieh et al.
patent: 5412237 (1995-05-01), Komori et al.
patent: 5441902 (1995-08-01), Hsieh et al.
patent: 5468990 (1995-11-01), Daum
patent: 5475251 (1995-12-01), Kuo et al.
patent: 5506806 (1996-04-01), Fukushima
patent: 5531018 (1996-07-01), Saia et al.
patent: 5539224 (1996-07-01), Ema
patent: 5541614 (1996-07-01), Lam et al.
patent: 5571735 (1996-11-01), Mogami et al.
patent: 5576988 (1996-11-01), Kuo et al.
patent: 5611940 (1997-03-01), Zettler
patent: 5638946 (1997-06-01), Zavracky
patent: 5656836 (1997-08-01), Ikeda et al.
patent: 5677557 (1997-10-01), Wuu et al.
patent: 5679595 (1997-10-01), Chen et al.
patent: 5700704 (1997-12-01), Ikeda et al.
patent: 5719422 (1998-02-01), Burr et al.
patent: 5719430 (1998-02-01), Goto
patent: 5721150 (1998-02-01), Pasch
patent: 5783846 (1998-07-01), Baukus et al.
patent: 5821590 (1998-10-01), Lee et al.
patent: 5834851 (1998-11-01), Ikeda et al.
patent: 5838047 (1998-11-01), Yamauchi et al.
patent: 5854510 (1998-12-01), Sur, Jr. et al.
patent: 5866933 (1999-02-01), Baukus et al.
patent: 5880503 (1999-03-01), Matsumoto et al.
patent: 5888887 (1999-03-01), Li et al.
patent: 5895241 (1999-04-01), Lu et al.
patent: 5920097 (1999-07-01), Horne
patent: 5930663 (1999-07-01), Baukus et al.
patent: 5930667 (1999-07-01), Oda
patent: 5973375 (1999-10-01), Baukus et al.
patent: 5977593 (1999-11-01), Hara
patent: 5998257 (1999-12-01), Lane et al.
patent: 6037627 (2000-03-01), Kitamura et al.
patent: 6046659 (2000-04-01), Loo et al.
patent: 6054659 (2000-04-01), Lee et al.
patent: 6057520 (2000-05-01), Goodwin-Johansson
patent: 6080614 (2000-06-01), Neilson et al.
patent: 6093609 (2000-07-01), Chuang
patent: 6117762 (2000-09-01), Baukus et al.
patent: 6118152 (2000-09-01), Yamaguchi et al.
patent: 6137318 (2000-10-01), Takaaki
patent: 6154388 (2000-11-01), Oh
patent: 6166419 (2000-12-01), Araki
patent: 6215158 (2001-04-01), Choi
patent: 6255155 (2001-07-01), Lee et al.
patent: 6294816 (2001-09-01), Baukus et al.
patent: 6326675 (2001-12-01), Scott et al.
patent: 6365453 (2002-04-01), Deboer et al.
patent: 6503787 (2003-01-01), Choi
patent: 6570222 (2003-05-01), Nozaki et al.
patent: 6740942 (2004-05-01), Baukus et al.
patent: 0 186 855 (1986-07-01), None
patent: 0 364 769 (1990-04-01), None
patent: 0 463 373 (1992-01-01), None
patent: 0 528 302 (1993-02-01), None
patent: 0 585 601 (1994-03-01), None
patent: 0 764 985 (1997-03-01), None
patent: 0 883 184 (1998-12-01), None
patent: 0 920 057 (1999-06-01), None
patent: 1 193 758 (2002-04-01), None
patent: 1 202 353 (2002-05-01), None
patent: 2486717 (1982-01-01), None
patent: 58-190064 (1983-11-01), None
patent: 61-147551 (1986-07-01), None
patent: 63 129647 (1988-06-01), None
patent: 02-046762 (1990-02-01), None
patent: 02-237038 (1990-09-01), None
patent: 10-256398 (1998-09-01), None
patent: 9821734 (1998-05-01), None
patent: 9857373 (1998-12-01), None
patent: 0044012 (2000-07-01), None
Blythe, et al., “Layout Reconstruction of Complex Silicon Chips,”IEEE Journal of Solid-State Circuits, pp. 138-145 (Feb. 1993).
Document No. 02237038, dated Dec. 9, 1990, Patent Abstracts of Japan, vol. 014, No. 550 (E-1009).
Document No. 63129647, dated Jun. 2, 1988, Patent Abstracts of Japan, vol. 012, No. 385 (E-668), Oct. 14, 1998.
Frederiksen, Thomas M., “Standard Circuits in the New CMOS Era,”Intuitive CMOS Electronics, Revised Edition, pp. 134-146 (1989).
Hodges and Jackson,Analysis and Design of Digital Integrated Circuits, 2nd edition, McGraw-Hill, p. 353 (1988).
IBM_TDB, “Double Polysilicon Dynamic Memory Cell with Polysilicon Bit line,” pp. 3828-3831 (Feb. 1979).
IBM_TDB, “Static Ram Double Polysilicon Process,” pp. 3683-3686 (Jan. 1981).
Ng, K.K.,Complete Guide to Semiconductor Devices, McGraw-Hill, Inc., pp 164-165 (1995).
Patent Abstracts of Japan, vol. 016, No. 197 (p-1350) May 12, 1992 & JP-A-40 28 092 (Toshiba Corp), abstract.
Larson, L.E., et al., “Microactuators for GaAs-based Microwave Integrated Circuits,”IEEE, pp. 743-746 (1991).
Lee, “Engineering a Device for Electron-beam Probing,”IEEE Design and Test of Computers, pp. 36-49 (1989).
Sze, S.M.,VLSI Technology, McGraw-Hill, pp. 99, 447, 461-465 (1983).
Sze, S.M., ed., “Silicides for Gates and Interconnections,”VLSI Technology, McGraw-Hill, pp. 372-380 (1983).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Programmable connector/isolator and double polysilicon layer... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Programmable connector/isolator and double polysilicon layer..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Programmable connector/isolator and double polysilicon layer... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3449533

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.