Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With workpiece support
Reexamination Certificate
2007-11-27
2007-11-27
Kackar, Ram N. (Department: 1763)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With workpiece support
C156S345520, C156S345530, C118S724000, C118S725000, C118S726000, C204S298010, C216S067000
Reexamination Certificate
active
11000894
ABSTRACT:
Components of semiconductor processing apparatus comprise thermal sprayed yttria-containing coatings that provide erosion, corrosion and/or corrosion-erosion resistance in plasma atmospheres. The coatings can protect substrates from physical and/or chemical attack.
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Daugherty John E.
O'Donnell Robert J.
Buchanan & Ingersoll & Rooney PC
Kackar Ram N.
Lam Research Corporation
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