Processing system and method for chemically treating a TERA...

Etching a substrate: processes – Etching and coating occur in the same processing chamber

Reexamination Certificate

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C216S002000, C216S041000, C216S058000, C216S067000, C216S069000, C438S694000, C438S710000

Reexamination Certificate

active

07097779

ABSTRACT:
A processing system and method for chemically treating a TERA layer on a substrate. The chemical treatment of the substrate chemically alters exposed surfaces on the substrate. In one embodiment, the system for processing a TERA layer includes a plasma-enhanced chemical vapor deposition (PECVD) system for depositing the TERA layer on the substrate, an etching system for creating features in the TERA layer, and a processing subsystem for reducing the size of the features in the TERA layer.

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Matthew Sendelbach et al., “Feedforward of mask open measurements on an integrated scatterometer to improve gate linewidth control”, Proceedings of the SPIE, SPIE (Bellingham, WA), vol. 5375, pp. 686-702, (May 24, 2004).

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