Processing pad assembly with zone control

Abrading – Precision device or process - or with condition responsive... – Computer controlled

Reexamination Certificate

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C451S287000, C451S529000, C205S662000, C205S663000

Reexamination Certificate

active

10727774

ABSTRACT:
An electrochemical mechanical processing station having a zoned polishing pad assembly is provided. The zoned polishing pad assembly includes a conductive layer coupled to an upper layer having a non-conductive processing surface. At least two zones of different current permeability are defined across the processing surface of the upper layer. Each zone is defined by an attribute of the upper layer.

REFERENCES:
patent: 3162588 (1964-12-01), Bell
patent: 3448023 (1969-06-01), Bell
patent: 3873512 (1975-03-01), Latanision
patent: 3942959 (1976-03-01), Markoo et al.
patent: 3992178 (1976-11-01), Markoo et al.
patent: 4125444 (1978-11-01), Inoue
patent: 4713149 (1987-12-01), Hoshino
patent: 4793895 (1988-12-01), Kaanta et al.
patent: 4839005 (1989-06-01), Katsumoto et al.
patent: 4839993 (1989-06-01), Masuko et al.
patent: 4934102 (1990-06-01), Leach et al.
patent: 4954141 (1990-09-01), Takiyama et al.
patent: 4956056 (1990-09-01), Zubatova et al.
patent: 5061294 (1991-10-01), Harmer et al.
patent: 5096550 (1992-03-01), Mayer et al.
patent: 5108463 (1992-04-01), Buchanan
patent: 5136817 (1992-08-01), Tabata et al.
patent: 5217586 (1993-06-01), Datta et al.
patent: 5225034 (1993-07-01), Yu et al.
patent: 5257478 (1993-11-01), Hyde et al.
patent: 5478435 (1995-12-01), Murphy et al.
patent: 5534106 (1996-07-01), Cote et al.
patent: 5543032 (1996-08-01), Datta et al.
patent: 5562529 (1996-10-01), Kishii et al.
patent: 5567300 (1996-10-01), Datta et al.
patent: 5575706 (1996-11-01), Tsai et al.
patent: 5578362 (1996-11-01), Reinhardt et al.
patent: 5624300 (1997-04-01), Kishii et al.
patent: 5637031 (1997-06-01), Chen
patent: 5738574 (1998-04-01), Tolles et al.
patent: 5804507 (1998-09-01), Perlov et al.
patent: 5807165 (1998-09-01), Uzoh et al.
patent: 5823854 (1998-10-01), Chen
patent: 5840629 (1998-11-01), Carpio
patent: 5846882 (1998-12-01), Birang
patent: 5871392 (1999-02-01), Meikle et al.
patent: 5876271 (1999-03-01), Oliver
patent: 5893796 (1999-04-01), Birang et al.
patent: 5911619 (1999-06-01), Uzoh et al.
patent: 5931719 (1999-08-01), Nagahara et al.
patent: 5938801 (1999-08-01), Robinson
patent: 5985093 (1999-11-01), Chen
patent: 6001008 (1999-12-01), Fujimori et al.
patent: 6004880 (1999-12-01), Liu et al.
patent: 6010395 (2000-01-01), Nakajima
patent: 6017265 (2000-01-01), Cook et al.
patent: 6020264 (2000-02-01), Lustig et al.
patent: 6024630 (2000-02-01), Shendon et al.
patent: 6033293 (2000-03-01), Crevasse et al.
patent: 6056851 (2000-05-01), Hsieh et al.
patent: 6066030 (2000-05-01), Uzoh
patent: 6074284 (2000-06-01), Tani et al.
patent: 6077337 (2000-06-01), Lee
patent: 6090239 (2000-07-01), Liu et al.
patent: 6103096 (2000-08-01), Datta et al.
patent: 6116998 (2000-09-01), Damgaard et al.
patent: 6153043 (2000-11-01), Edelstein et al.
patent: 6156124 (2000-12-01), Tobin
patent: 6159079 (2000-12-01), Zuniga et al.
patent: 6171467 (2001-01-01), Weihs et al.
patent: 6176992 (2001-01-01), Talieh
patent: 6183354 (2001-02-01), Zuniga et al.
patent: 6190494 (2001-02-01), Dow
patent: 6210257 (2001-04-01), Carlson
patent: 6234870 (2001-05-01), Uzoh et al.
patent: 6238271 (2001-05-01), Cesna
patent: 6238592 (2001-05-01), Hardy et al.
patent: 6244935 (2001-06-01), Birang et al.
patent: 6248222 (2001-06-01), Wang
patent: 6251235 (2001-06-01), Talieh et al.
patent: 6261168 (2001-07-01), Jensen et al.
patent: 6261959 (2001-07-01), Travis et al.
patent: 6273798 (2001-08-01), Berman
patent: 6297159 (2001-10-01), Paton
patent: 6319420 (2001-11-01), Dow
patent: 6328642 (2001-12-01), Pant et al.
patent: 6328872 (2001-12-01), Talieh et al.
patent: 6331135 (2001-12-01), Sabde et al.
patent: 6368184 (2002-04-01), Beckage
patent: 6381169 (2002-04-01), Bocian et al.
patent: 6386956 (2002-05-01), Sato et al.
patent: 6391166 (2002-05-01), Wang
patent: 6395152 (2002-05-01), Wang
patent: 6402591 (2002-06-01), Thornton
patent: 6402925 (2002-06-01), Talieh
patent: 6406363 (2002-06-01), Xu et al.
patent: 6409904 (2002-06-01), Uzoh et al.
patent: 6413388 (2002-07-01), Uzoh et al.
patent: 6413403 (2002-07-01), Lindquist et al.
patent: 6428394 (2002-08-01), Mooring et al.
patent: 6431968 (2002-08-01), Chen et al.
patent: 6440295 (2002-08-01), Wang
patent: 6447668 (2002-09-01), Wang
patent: 6464855 (2002-10-01), Chadda et al.
patent: 6471847 (2002-10-01), Talieh et al.
patent: 6475332 (2002-11-01), Boyd et al.
patent: 6479962 (2002-11-01), Ziemkowski et al.
patent: 6482307 (2002-11-01), Ashjaee et al.
patent: 6497800 (2002-12-01), Talieh et al.
patent: 6517426 (2003-02-01), Lee
patent: 6537144 (2003-03-01), Tsai et al.
patent: 6551179 (2003-04-01), Halley
patent: 6561889 (2003-05-01), Xu et al.
patent: 6569004 (2003-05-01), Pham
patent: 6572463 (2003-06-01), Xu et al.
patent: 6585579 (2003-07-01), Jensen et al.
patent: 6630059 (2003-10-01), Uzoh et al.
patent: 6638863 (2003-10-01), Wang et al.
patent: 6666959 (2003-12-01), Uzoh et al.
patent: 6726823 (2004-04-01), Wang et al.
patent: 6736952 (2004-05-01), Emesh
patent: 6739951 (2004-05-01), Sun et al.
patent: 6802955 (2004-10-01), Emesh et al.
patent: 2001/0005667 (2001-06-01), Tolles et al.
patent: 2001/0024878 (2001-09-01), Nakamura
patent: 2001/0027018 (2001-10-01), Molnar
patent: 2001/0035354 (2001-11-01), Ashjaee et al.
patent: 2001/0036746 (2001-11-01), Sato et al.
patent: 2001/0040100 (2001-11-01), Wang
patent: 2001/0042690 (2001-11-01), Talieh
patent: 2002/0008036 (2002-01-01), Wang
patent: 2002/0011417 (2002-01-01), Talieh et al.
patent: 2002/0020621 (2002-02-01), Uzoh et al.
patent: 2002/0025760 (2002-02-01), Lee et al.
patent: 2002/0025763 (2002-02-01), Lee
patent: 2002/0070126 (2002-06-01), Sato
patent: 2002/0077037 (2002-06-01), Tietz
patent: 2002/0088715 (2002-07-01), Talieh et al.
patent: 2002/0108861 (2002-08-01), Emesh
patent: 2002/0119286 (2002-08-01), Chen et al.
patent: 2002/0123300 (2002-09-01), Jones et al.
patent: 2002/0130049 (2002-09-01), Chen et al.
patent: 2002/0130634 (2002-09-01), Ziemkowski et al.
patent: 2003/0114087 (2003-06-01), Duboust et al.
patent: 2003/0116445 (2003-06-01), Sun et al.
patent: 2003/0116446 (2003-06-01), Duboust et al.
patent: 2003/0129927 (2003-07-01), Lee et al.
patent: 2003/0213703 (2003-11-01), Wang et al.
patent: 0 325 753 (1989-08-01), None
patent: 0 455 455 (1991-04-01), None
patent: 10-6213 (1998-01-01), None
patent: 2870537 (1999-01-01), None
patent: 11-042554 (1999-02-01), None
patent: 2000-218513 (2000-08-01), None
patent: 2001-77117 (2001-03-01), None
patent: 2001-244223 (2001-09-01), None
patent: WO-1998-49723 (1998-11-01), None
patent: WO-1999-41434 (1999-08-01), None
patent: WO-1999-53119 (1999-10-01), None
patent: WO-2000-03426 (2000-01-01), None
patent: WO-2000-26443 (2000-05-01), None
patent: WO-2000-33356 (2000-06-01), None
patent: WO-2000-59682 (2000-10-01), None
patent: WO-2001-13416 (2001-02-01), None
patent: WO-2001-49452 (2001-07-01), None
patent: WO-2001-52307 (2001-07-01), None
patent: WO-2001-63018 (2001-08-01), None
patent: WO-2001-71066 (2001-09-01), None
patent: WO-2001-88229 (2001-11-01), None
patent: WO-2001-88954 (2001-11-01), None
patent: WO-2002-23616 (2002-03-01), None
patent: WO-2002-064314 (2002-08-01), None
patent: WO -2003-001581 (2003-01-01), None
International Search Report for PCT/US 02/11009 dated Feb. 6, 2003 (4100EP02).
Contolini “Electrochemical Planarization of ULSI Copper,”Solid State Technology; vol. 40, No. 6, Jun. 1, 1997, pp. 155-156, 158, 160, 162.
Nogami “An Innovation to Integrate Porous Low-K Materials and Copper”,Interconnect Japan 2001; Honeywell Seminar (Dec. 6, 2001); pp. 1-12.
Alexander, et al., “Electrically Conductive Polymer Nanocomposite Materials,” www.afrlhorizons.com/Briefs/Sept02/ML0206.html, date unknown.
PCT Written Opinion for PCT/US03/01760 dated Mar. 8, 2004 (AMAT/6339.PC).

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