Processing method for glass substrate, processed glass...

Details Processing method for glass substrate, processed glass... Processing method for glass substrate, processed glass...

2008-04-08

2008-04-08

Norton, Nadine (Department: 1792)

Etching a substrate: processes

Gas phase etching of substrate

Etching inorganic substrate

C216S076000, C216S088000, C065S030140, C065S031000, C065S061000, C065S111000, C065S116000, C360S254000, C428S141000, C428S426000, C428S691000, C428S066600, C451S035000, C451S036000, C451S041000, C451S104000

Reexamination Certificate

active

10993422

ABSTRACT:
A processing method for glass substrate of the present invention includes: applying heat and external force to a glass substrate and then cooling it down to thereby form a compression stressed part having a different etching rate from that of other parts with respect to an etching reagent to be used, on the surface of the glass substrate and in the vicinity thereof, and performing chemical etching using the etching reagent on the glass substrate having the compression stressed part formed thereon, so as to form a relief on the surface of the glass substrate.

REFERENCES:
patent: 4969944 (1990-11-01), Marechal et al.
patent: 6627565 (2003-09-01), Zou et al.
patent: 6782717 (2004-08-01), Saito et al.
patent: 6913702 (2005-07-01), Kurachi et al.
patent: 2002-030440 (2002-01-01), None
patent: 2002-160943 (2002-06-01), None
patent: 2003-073145 (2003-03-01), None

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