Processing method for conservation of processing gases

Etching a substrate: processes – Gas phase etching of substrate

Reexamination Certificate

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C156S345290, C118S715000

Reexamination Certificate

active

07628931

ABSTRACT:
In order to facilitate control of a circulating gas, in a processing apparatus100having a showerhead200for supplying a processing gas into a processing chamber via a plurality of gas supply holes, a turbo pump120for evacuating the processing gas from the processing chamber110and a circulating gas piping150for returning at least a portion (circulating gas Q2) of the exhaust gas evacuated from the processing chamber by the turbo pump to the showerhead, the showerhead is provided with a primary gas supply system that supplies a primary gas Q1supplied from a gas source140into the processing chamber via a plurality of primary gas outlet holes h1and a circulating gas supply system that supplies the circulating gas into the processing chamber via a plurality of circulating gas supply holes h2, with the primary gas supply system and the circulating gas supply system constituted as systems independent of each other. Since the primary gas and the circulating gas are allowed to become mixed only in the processing chamber, the circulating gas can be controlled with a greater degree of ease without having to implement pressure control.

REFERENCES:
patent: 3854443 (1974-12-01), Baerg
patent: 5453124 (1995-09-01), Moslehi et al.
patent: 6086677 (2000-07-01), Umotoy et al.
patent: 6277173 (2001-08-01), Sadakata et al.
patent: 04-107280 (1992-04-01), None
patent: 09-251981 (1997-11-01), None

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