Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – Having glow discharge electrode gas energizing means
Reexamination Certificate
2004-06-01
2009-11-24
Zervigon, Rudy (Department: 1792)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
Having glow discharge electrode gas energizing means
C118S7230ER, C118S666000, C118S663000, C118S728000, C156S345270, C156S345240
Reexamination Certificate
active
07622017
ABSTRACT:
A processing apparatus for performing a process on a surface of an object to be processed by applying a high frequency power to an electrode installed in an airtight processing chamber to convert a processing gas introduced therein into a plasma, includes a thermal transfer gas feed pathway for supplying a thermal transfer gas for controlling a temperature of the object to be processed to a minute space between the object to be processed and a holding unit installed on the electrode for attracting and holding the object to be processed through an inner portion of an insulating member disposed under the electrode. A portion of the thermal transfer gas feed pathway, which passes through the inner portion of the insulating member, is formed in a zigzag shape or a spiral shape with respect to a normal direction of a holding surface of the holding unit.
REFERENCES:
patent: 4565601 (1986-01-01), Kakehi et al.
patent: 4771730 (1988-09-01), Tezuka
patent: 5177878 (1993-01-01), Visser
patent: 5194118 (1993-03-01), Shinohara
patent: 5255153 (1993-10-01), Nozawa et al.
patent: 5376213 (1994-12-01), Ueda et al.
patent: 5382311 (1995-01-01), Ishikawa et al.
patent: 5529657 (1996-06-01), Ishii
patent: 5542559 (1996-08-01), Kawakami et al.
patent: 5547539 (1996-08-01), Arasawa et al.
patent: 5622593 (1997-04-01), Arasawa et al.
patent: 5625526 (1997-04-01), Watanabe et al.
patent: 5698062 (1997-12-01), Sakamoto et al.
patent: 5775416 (1998-07-01), Heimanson et al.
patent: 5835334 (1998-11-01), McMillin et al.
patent: RE36810 (2000-08-01), Arasawa et al.
patent: 6106737 (2000-08-01), Tomoyasu et al.
patent: 6780278 (2004-08-01), Hayashi et al.
patent: 63-102319 (1988-05-01), None
patent: 04-233728 (1992-08-01), None
patent: 06-244119 (1994-09-01), None
http://www.matweb.com/search/SpecificMaterial.asp?bassnum=BQUARTZ.
Endoh Shosuke
Hayashi Daisuke
Himori Shinji
Kubota Tomoya
Nagaseki Kazuya
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
Tokyo Electron Limited
Zervigon Rudy
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