Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1987-10-19
1990-01-09
Hoch, Raymond
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156662, 430272, 430313, 430317, B44C 122, G03C 500
Patent
active
048926175
ABSTRACT:
Extremely useful compositions for delineation of materials utilized in device applications have been found. These compositions include a polymer having segments that are at least 10 monomer units long of a first entity and segments again at least 10 monomer units long of a second entity. The monomer units are chosen so that each segment type provides a specific chemical characteristic to the polymer.
REFERENCES:
patent: 3794510 (1974-02-01), Scala et al.
patent: 3951709 (1976-04-01), Jacob
patent: 3969543 (1976-07-01), Roberts et al.
patent: 4061799 (1977-12-01), Brewer
patent: 4078927 (1978-03-01), Amidon et al.
patent: 4286049 (1981-08-01), Imamura et al.
patent: 4323636 (1982-04-01), Chen
patent: 4464460 (1984-08-01), Hiraoka et al.
patent: 4481049 (1984-11-01), Reichmanis et al.
patent: 4521274 (1985-06-01), Reichmanis et al.
patent: 4551417 (1985-11-01), Suzuki et al.
Morita et al., "High Resolution Double Layer Resist System Using New Silicone Based Negative Resist (SNR)", Japanese Journal of Applied Physics, vol. 22, No. 10, part 2, Oct. 1983, pp. 659-660.
Suzuki et al., "Copolymers of Trimethylsilylstyrene with Chloromethylstyrene for a Bi-Layer Resist System", Journal of the Electrochemical Society, vol. 130, No. 9, Sep. 1983, pp. 1962-1964.
Choong et al., "Molecular Parameters and Lithographic Performance of Poly(Chloromethylstyrene) . . . ", J. Vac. Sci. Technol., vol. 19, No. 4, Nov./Dec. 1981, pp. 1121-1126.
Roberts, E. D., "Recent Developments in Electron Resists", Solid State Technology, vol. 27, No. 6, Jun. 1984, pp. 135-141.
Jackson, G. N., "RF Sputtering", Thin Solid Films, 5 (1970), No. 4, pp. 227-230.
Bates Frank S.
Hartney Mark A.
Novembre Anthony E.
American Telephone & Telegraph Company AT&T Bell Laboratories
Hoch Raymond
Schneider Bruce S.
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