Process to manufacture nonvolatile MOS memory device

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S962000

Reexamination Certificate

active

06962850

ABSTRACT:
Devices with embedded silicon or germanium nanocrystals, fabricated using ion implantation, exhibit superior data-retention characteristics relative to conventional floating-gate devices. However, the prior art use of ion implantation for their manufacture introduces several problems. These have been overcome by initial use of rapid thermal oxidation to grow a high quality layer of thin tunnel oxide. Chemical vapor deposition is then used to deposit a germanium doped oxide layer. A capping oxide is then deposited following which the structure is rapid thermally annealed to synthesize the germanium nanocrystals.

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Ghandhi, “VLSI Fabrication Principles”, 1983, pp. 420-424.
Ya-Chin King et al., “MOS Memory Using Germanium Nanocrystals Formed by Thermal Oxidation of Si1-X Gex,” IEDM Tech. Digest, 1998, pp. 115-118.
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