Process of vapor depositing glass layers for wafer-level...

Details Process of vapor depositing glass layers for wafer-level... Process of vapor depositing glass layers for wafer-level...

2011-01-04

2011-01-04

Crane, Sara (Department: 2811)

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

Insulative material deposited upon semiconductive substrate

C257SE21275, C257SE21280, C257SE21503

Reexamination Certificate

active

07863200

ABSTRACT:
A process to encapsulate electronic modules in a manner which is substantially resistant to water diffusion yet is carried out at moderate temperatures below 300° C., preferably below 150° C. is provided. The process forms a housing for electronic modules, in particular sensors, integrated circuits and optoelectronic components. The process includes the steps of: providing a substrate, of which at least a first substrate side is to be encapsulated; providing a vapor-deposition glass source; arranging the first substrate side in such a manner with respect to the vapor-deposition glass source that the first substrate side can be vapor-coated; and vapor-coating the first substrate side with a glass layer.

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Glass Dynamics webpages for selected Corning Glasses. 7 Pages total.

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