4. Compositions: ceramic
  5. Ceramic compositions
  6. Glass compositions, compositions containing glass other than...

Dietrich Mund

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Composite solder glass, filling material for same and...

Compositions: ceramic – Ceramic compositions – Glass compositions – compositions containing glass other than...
Reexamination Certificate

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Hermetic encapsulation of organic, electro-optical elements

Electric lamp and discharge devices – With luminescent solid or liquid material – Solid-state type
Reexamination Certificate

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Method for connecting substrate and composite element

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Having enclosed cavity
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Method for connecting substrate and composite element

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Having enclosed cavity
Reexamination Certificate

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Method for hermetically housing optical components, and...

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2040444

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