Process of photopatterning a substrate with a positive photoresi

Details Process of photopatterning a substrate with a positive photoresi Process of photopatterning a substrate with a positive photoresi

1994-04-14

1995-03-21

McCamish, Marion E.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Forming nonplanar surface

G03C 500

Patent

active

053994639

ABSTRACT:
Addition of compounds of formula I ##STR1## in which R.sup.1 to R.sup.4 are each hydroxyl or C.sub.1-6 -alkoxy and R.sup.5 to R.sup.10 are each hydrogen or C.sub.1-6 -alkyl,
to positive photoresist compositions based on a diazoquinone
ovolak resin effectively suppresses stray radiation and halation effects in corresponding photoresist coatings, in particular if these coatings have been applied to highly reflective substrates.

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Elliott, D. J., Integrated Circuit Fabrication Technology, 1982, pp. 186-188.
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IEEE Transactions on Electron Devices, ED-28, No. 11, 1405-1410 (1981).
Cernigliaro, G. J. et al., "Dissolution Rate . . . Positive Photoresists", SPIE, vol. 1086, Advances in Resist Technology and Processing VI (1989), pp. 106-116.
Renschler, C. L. et al., J. Electrochem. Soc., vol. 136, No. 1, Jan. 1989, pp. 281-283.

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