Process of forming resist image in positive photoresist with the

Details Process of forming resist image in positive photoresist with the Process of forming resist image in positive photoresist with the

1990-06-18

1991-03-19

Bowers, Jr., Charles L.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Forming nonplanar surface

430165, 430191, 430192, 430296, 430323, 430330, G03F 730, G03F 7023

Patent

active

050010409

ABSTRACT:
A phenolic novolak resin comprising the product of a condensation reaction of an aldehyde comprising a haloacetaldehyde source or a mixture of a haloacetaldehyde source and a formaldehyde source with a phenolic monomer comprising at least one compound of the formula: ##STR1## wherein R.sub.1, R.sub.2 and R.sub.3 are individually selected from hydrogen or a one to four carbon alkyl group and wherein the ratio of total carbon atoms in the sum of R.sub.1, R.sub.2 and R.sub.3 to the total number of phenolic nuclei in said resin is from about 0.5:1 to about 1.5:1 in the presence of a solvent; said resin made by employing a molar ratio of total aldehyde to total phenolic monomers from about 0.33:1 to about 0.70:1. These phenolic resins are suitable for use in light-sensitive compositions (e.g. positive-working photoresists).

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Pampalone, T. R., Solid State Technology, 6/1984, pp. 115-120.
Hiraoka, H., ACS Symposium Series No. 266, 1984 pp. 339-359.
English abstract of Japanese Pat. Pub. #85-008023, published 2/28/85, (Mitsui Petrochem. Ind. KK).

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