Process of forming polyimide pattern and developer therefor

Details Process of forming polyimide pattern and developer therefor Process of forming polyimide pattern and developer therefor

1983-06-17

1985-10-15

Kittle, John

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Forming nonplanar surface

430197, 430195, 430283, 430287, 430330, 430331, 430281, G03C 516, G03C 170

Patent

active

045474559

ABSTRACT:
A process of forming a polyimide pattern on a base plate, which comprises exposing imagewise a layer of photosensitive polyimide precursor on the base plate, removing unexposed areas by developing and curing the resultant pattern of the polyimide precursor, characterized by employing a developer containing (A) at least one solvent selected from the group consisting of N,N-dimethylacetamide, N-methyl-2-pyrrolidone, N,N-dimethylformamide, dimethylsulfoxide and .gamma.-butyrolactone, (B) methanol and (C) at least one solvent represented by the formula;

REFERENCES:
patent: 3957512 (1976-05-01), Kleeberg et al.
patent: 4040831 (1977-08-01), Rubner et al.
patent: 4093461 (1978-06-01), Loprest et al.
patent: 4093465 (1978-06-01), Chu et al.
patent: 4243743 (1981-01-01), Hiramoto et al.
patent: 4310641 (1982-01-01), Ohmura et al.
patent: 4321319 (1982-03-01), Shoji et al.
patent: 4329419 (1982-05-01), Goff et al.
patent: 4332883 (1982-06-01), Ahne et al.
patent: 4403029 (1983-09-01), Ward, Jr. et al.
patent: 4451551 (1984-05-01), Kataoka et al.
Ibert Mellan, Industrial Solvents Handbook 1970, Noyes Data Corporation, Park Ridge, N.J., 1970, pp. 293-303, 320-321.

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