Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent
1997-04-10
1998-06-23
Niebling, John
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
438107, 438108, 438109, H01L 2144, H01L 2148, H01L 2150
Patent
active
057704805
ABSTRACT:
A device and method for increasing integrated circuit density comprising at least a pair of superimposed dice, wherein a least one of the superimposed dice has at least one bond pad variably positioned on an active surface of the die. A plurality of lead fingers from a leadframe extend between the dice. The leadframe comprises at least one lead with leads of non-uniform length and configuration to attach to the differently positioned bond pads of the multiple die. An advantage of the present invention is that it allows dice with differing bond pad arrangements to be used in a superimposed configuration to increase circuit density, while eliminating the use of bond wires in such a configuration.
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Bruce Jeffrey D.
Habersetzer Daryl L.
Ma Manny Kin F.
Miller James E.
Roberts Gordon D.
Micro)n Technology, Inc.
Niebling John
Zarneke David A.
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