Process of forming a resist structure on substrate having topogr

Details Process of forming a resist structure on substrate having topogr Process of forming a resist structure on substrate having topogr

1986-09-09

1988-11-15

Bowers, Jr., Charles L.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Forming nonplanar surface

430166, 430271, 430311, 430313, 430322, 430326, 430312, G03F 726

Patent

active

047849363

ABSTRACT:
An improved process for forming multilayer resist structures for lithographic processing of a substrate having topographical features is provided. The structures are comprised of a resist layer having thereover a layer of poly(vinyl pyrrolidone). When the resist layer is a photoresist, the subject structures may optionally contain an absorptive layer directly overlying the substrate and/or a layer of contrast enhancement material overlying the planarizing layer. The poly(vinyl pyrrolidone) optionally contains from about 0.05 to about 0.1 percent by weight of a suitable surfactant, suitably a nonionic surfactant.

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Griffing et al., Solid State Technology, May. 1985, pp. 152-157.

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