Process for the production of photoresist relief structures havi

Details Process for the production of photoresist relief structures havi Process for the production of photoresist relief structures havi

1985-07-26

1987-03-10

Bowers, Jr., Charles L.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Forming nonplanar surface

430296, 430315, 430324, 430331, G03F 726

Patent

active

046491015

ABSTRACT:
A process for the production of photoresist relief structures possessing an overhang character comprising coating a substrate with a positive-working photoresist composition based on phenol/formaldehyde condensates of the novolak resin type and photosensitive o-quinonediazide compounds, imagewise overexposure of the photoresist layer at an energy exceeding that required to produce relief structures with a 90.degree. angle between the photoresist compound and the substrate, and treatment of the overexposed layer and substrate with a buffered, aqueous, alkaline developer containing 1-100 ppm of an oxyethylated alkylphenol as a non-ionic surfactant.

REFERENCES:
patent: 3586504 (1971-06-01), Coates et al.
patent: 3849136 (1974-11-01), Grebe
patent: 3867148 (1975-02-01), O'Keeffe et al.
patent: 4218532 (1980-08-01), Dunkleberger
patent: 4576903 (1986-03-01), Baron et al.
DeForest, W. S., "Photoresist Materials and Processes", McGraw-Hill Book Co., 1975, pp. 149-156.
Elliott, David J., "Integrated Circuit Fabrication Technology, McGraw-Hill Book Co., 1982, pp. 172-179.

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