Process for protecting bonded components from plating shorts

Details Process for protecting bonded components from plating shorts Process for protecting bonded components from plating shorts

1994-10-14

2000-04-18

Nelms, David

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

205123, 205125, H01L 2144

Patent

active

060514930

ABSTRACT:
A method which protects the region between a component and the substrate onto which the components is bonded using an electrically insulating fillet of photoresist. The fillet protects the regions from subsequent plating with metal and therefore shorting the plated conductors which run down the sides of the component and onto the substrate.

REFERENCES:
patent: 4594606 (1986-06-01), Goto
patent: 4624749 (1986-11-01), Black
patent: 4965646 (1990-10-01), Ipri
patent: 5098526 (1992-03-01), Bernhardt
Applied Surface Science 46 (1990) pp. 121-130, A.F. Bernhardt et al., "Multichip Packaging For Very-High-Speed Digital Systems", North-Holland Physics Publishing.

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