4. Heat exchange
  5. With valve or movable deflector for heat exchange fluid flow
  6. With by-pass of heat exchanger or heat exchanger section

Wayne L. Bonde

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Microchannel heat sink assembly

Heat exchange – With valve or movable deflector for heat exchange fluid flow – With by-pass of heat exchanger or heat exchanger section
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Process for protecting bonded components from plating shorts

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Profile ID: LFUS-PAI-P-1796570

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