Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1975-07-16
1978-05-02
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156192, 156289, 156309, 156312, 156324, B32B 1508, B32B 3120
Patent
active
040873005
ABSTRACT:
At least one conductive metal foil is preliminarily bonded to an electrically insulating resinous substrate by squeezing the layers together under heat and pressure in a continuous mode, as by passing the layers through a nip roll to produce a partially cured resinous layer subjacent to the metal foil. The thus preliminarily bonded laminate is further processed in an autoclave, under heat and pressure, whereby the bonding layer between the metal and the substrate is cured. The laminate formed by this process is useful for metal-clad boards, particularly printed circuit boards. These boards may be either flexible or rigid.
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"Adhesive Bonding of Reinforced Plastics", Perry, 1959, pp. 177-178.
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