Process for polishing III-V-semiconductor surfaces

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156662, 252 791, H01L 21306, B44C 122, C03C 1500, C03C 2506

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044486340

ABSTRACT:
Surfaces of III-V-semiconductors, especially gallium phosphide surfaces, can be polished very successfully if, in the polishing operation, an alkali metal hypochlorite solution adjusted to a pH value of from 8.5 to 11 by the addition of buffering components, and a liquid containing in addition to the mechanical polishing component a complex-forming component, are applied to the surface to be polished.

REFERENCES:
patent: 3775201 (1973-11-01), Basi
patent: 4043861 (1977-08-01), Jacob et al.
IBM Technical Disclosure Bulletin, vol. 23, No. 7A, Dec. 1980, Semiconduc Polishing Composition, B. Holley et al., p. 2750.

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