Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1983-07-15
1984-05-15
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156662, 252 791, H01L 21306, B44C 122, C03C 1500, C03C 2506
Patent
active
044486340
ABSTRACT:
Surfaces of III-V-semiconductors, especially gallium phosphide surfaces, can be polished very successfully if, in the polishing operation, an alkali metal hypochlorite solution adjusted to a pH value of from 8.5 to 11 by the addition of buffering components, and a liquid containing in addition to the mechanical polishing component a complex-forming component, are applied to the surface to be polished.
REFERENCES:
patent: 3775201 (1973-11-01), Basi
patent: 4043861 (1977-08-01), Jacob et al.
IBM Technical Disclosure Bulletin, vol. 23, No. 7A, Dec. 1980, Semiconduc Polishing Composition, B. Holley et al., p. 2750.
Powell William A.
Wacker-Chemitronic Gesellschaft fur Elektronik-Grundstoffe mbH
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