4. Cutting
  5. Processes

Wacker-Chemitronic Gesellschaft fur Elektronik-Grundstoffe mbH

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Apparatus and method of automatically separating stacked wafers

Conveyors: fluid current – With diverse power-driven conveyor – Magazine
Patent

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Apparatus for machining workpieces by abrasion

Stone working – Sawing – Reciprocating
Patent

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Apparatus for supporting crystalline wafers

Stone working – Work supports
Patent

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Clamping system for an annular-saw blade and its use in the sawi

Stone working – Sawing – Rotary
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Crucible-free zone refining of semiconductor material including

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
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