4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package

Nicolas Sillon

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Micro-component packaging process and set of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Process for packaging micro-components using a matrix

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2337112

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