Process for manufacturing non-volatile semiconductor memory devi

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

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438264, 438528, 438910, H01L 218247

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active

060690410

ABSTRACT:
A process for manufacturing a non-volatile semiconductor memory device by forming a tunnel dielectric film, a floating gate electrode, an interlayer capacitive film and a control gate electrode successively on a semiconductor substrate includes introducing nitrogen atoms into at least one of an interface between the floating gate electrode and the interlayer capacitive film and an interface between the interlayer capacitive film and the control gate electrode.

REFERENCES:
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patent: 5464792 (1995-11-01), Tseng et al.
patent: 5571734 (1996-11-01), Tseng et al.
patent: 5837585 (1998-11-01), Wu et al.
T. Kuroi, et al., 1994, Symposium on VLSI Technology Digest of Technical Papers, "The Effects of Nitrogen Implantation of into P Poly-Silicon Gate on Gate Oxide Properties", pp. 107-108.

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