Process for manufacturing micromechanical components having a pa

Details Process for manufacturing micromechanical components having a pa Process for manufacturing micromechanical components having a pa

1996-09-27

1999-11-30

Whitehead, Jr., Carl

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

438 50, 438 52, H01L 2100

Patent

active

059941600

ABSTRACT:
Process for manufacturing micromechanical components having a part made of diamond, consisting of at least one tip (3a), in which a substrate (8a) is prepared, in order to form an impression (13a) of the shape desired for the part made of diamond; the part made of diamond is produced by chemical vapor deposition of diamond in the impression and is then separated from the substrate. In order to produce the part made of diamond, a primary film of fine diamond particles, of diameter less than 10 nm, suitable to act as seeds for growth of the diamond are deposited on the substrate, on the surface of the impression (13a), before chemical vapor deposition; the diamond film is then grown by vapor deposition; and the substrate (8a) is then at least partly removed.

REFERENCES:
patent: 3888708 (1975-06-01), Wise et al.
patent: 5051379 (1991-09-01), Bayer et al.
patent: 5066358 (1991-11-01), Quate et al.
patent: 5204210 (1993-04-01), Jansen et al.
patent: 5221415 (1993-06-01), Albretch et al.
patent: 5619093 (1997-04-01), Glesener et al.
patent: 5811017 (1998-09-01), Matsuyama

Affiliated with

Also associated with

Rating

Process for manufacturing micromechanical components having a pa does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for manufacturing micromechanical components having a pa, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for manufacturing micromechanical components having a pa will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1670912