Process for manufacturing electronic circuits

Details Process for manufacturing electronic circuits Process for manufacturing electronic circuits

1999-06-01

2000-10-17

Picardat, Kevin M.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438613, H01L 2144

Patent

active

06133135&

ABSTRACT:
The process for manufacturing an electronic circuit includes disposing an electronic device on a circuit substrate and hot melting a solder formed on the electronic device or the circuit substrate to bond the electronic device and the circuit substrate. The process includes the steps of feeding a liquid onto lands on the circuit substrate, aligning and mounting the electronic device on the lands, placing the circuit substrate in a treating vessel and heating the circuit substrate. The heating step includes controlling a pressure of an atmosphere in the treating vessel, hot-melting the solder to prevent at least a portion of the liquid from evaporating until the electronic device and the circuit substrate are bonded and to permit the liquid to evaporate after the electronic device and the circuit substrate are bonded.

REFERENCES:
patent: 5232674 (1993-08-01), Mukai et al.
patent: 5433785 (1995-07-01), Saito
patent: 5451274 (1995-09-01), Gupta
patent: 5499668 (1996-03-01), Katayama et al.
patent: 5735961 (1998-04-01), Shimada
patent: 5940728 (1999-08-01), Katayama et al.

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