Process for manufacturing devices using maleimide containing res

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Forming nonplanar surface

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430325, 430326, 430330, 4302701, 430910, G03C 500

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active

057562660

ABSTRACT:
A lithographic process for fabricating a device is disclosed. An area of radiation sensitive material is formed on a substrate. The radiation sensitive material contains a polymeric component The polymeric component is the copolymerization product of a maleimide monomer and at least two other monomers. Acid labile groups are pendant to one of the monomers with which the maleimide monomer is copolymerized. The acid labile groups are pendant to less than 50 mole percent of the monomers that make up the copolymer. The acid labile groups are not pendant to the maleimide monomer.
The radiation sensitive material is patternwise exposed to radiation after it is formed on the substrate. The patternwise exposure transfers an image into the radiation sensitive material. The image is developed into a pattern in the radiation sensitive material. The pattern is then transferred into the substrate.

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Kwang-Duk Ahn et al., "Synthesis and polymerization of N-(tert-butyloxycarbonyl maleimide and facile deprotection of polymer side-chain t-BOC groups," Polymer, vol. 33, No. 22 (1992) pp. 4851-4856.
S.M. Sze, VLSI Technology, McGraw-Hill, New York, (1983).
L.F. Thompson, Introduction to Microlithography, American Chemical Society Symposium, Series 219, (1983) pp. 87-161.

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