Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent
1995-11-21
1998-09-08
Graybill, David
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
438123, 438124, 438460, 438613, H01L 2156, H01L 2158, H01L 2160
Patent
active
058044680
ABSTRACT:
A process for manufacturing semiconductor device having a package in which a semiconductor device is sealed includes a base, and a metallic film is formed on a surface of the base. The semiconductor chip is formed on the metallic film. A pad formed on the semiconductor chip is connected to the metallic film by a wire. A sealing layer is formed on the metallic film. Leads are formed on the glass layer. A connecting layer is formed on the metallic film and contains electrically conductive particles. The connecting layer is in contact with a lead for a power supply system and connecting the metallic film to the lead.
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Hamano Toshio
Hayakawa Michio
Ikemoto Yoshihiko
Kubota Yoshihiro
Miyaji Naomi
Fujitsu Limited
Graybill David
Kyushu Fujitsu Electronics Limited
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