Process for manufacturing a packaged semiconductor having a divi

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support

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Details

438123, 438124, 438460, 438613, H01L 2156, H01L 2158, H01L 2160

Patent

active

058044680

ABSTRACT:
A process for manufacturing semiconductor device having a package in which a semiconductor device is sealed includes a base, and a metallic film is formed on a surface of the base. The semiconductor chip is formed on the metallic film. A pad formed on the semiconductor chip is connected to the metallic film by a wire. A sealing layer is formed on the metallic film. Leads are formed on the glass layer. A connecting layer is formed on the metallic film and contains electrically conductive particles. The connecting layer is in contact with a lead for a power supply system and connecting the metallic film to the lead.

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