Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent
1998-07-08
2000-07-25
Fahmy, Wael
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
438781, 438622, 438763, 438780, H01L 214763, H01L 21469
Patent
active
060936363
ABSTRACT:
The invention relates to a process for forming an integrated circuit device comprising (i) a substrate; (ii) metallic circuit lines positioned on the substrate and (iii) a dielectric material positioned on the circuit lines. The dielectric material comprises porous organic polyarylene ether.
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Carter Kenneth Raymond
Dawson Daniel Joseph
Hawker Craig Jon
Hedrick James Lupton
Hedrick Jeffrey Curtis
Berezny Neal
Fahmy Wael
International Business Machines - Corporation
Morris Daniel P.
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