Food or edible material: processes – compositions – and products – Products per se – or processes of preparing or treating... – Plant material is basic ingredient other than extract,...
Patent
1997-10-27
1999-03-23
Bhat, Nina
Food or edible material: processes, compositions, and products
Products per se, or processes of preparing or treating...
Plant material is basic ingredient other than extract,...
426654, 426613, A23L 138
Patent
active
058856463
ABSTRACT:
A process for preparing nut spreads having a sugar level of from about 15 to about 50% and especially flavored nut spreads having such relatively high levels of sugar. A substantially homogeneous blend is prepared from a fluid suspension consisting essentially of an intimate mixture of sugar, liquid oil and lecithin as a surfactant to improve the fluidity of the suspension, a nut solids-containing mixture and a flavorant that is preferably added to the fluid suspension. The resulting flavored nut spreads are more fluid and softer than products made without using the fluid suspension.
REFERENCES:
patent: H1395 (1995-01-01), Prosser
patent: 3978246 (1976-08-01), Chozianin et al.
patent: 3995068 (1976-11-01), Billerbeck et al.
patent: 5079027 (1992-01-01), Wong et al.
patent: 5230919 (1993-07-01), Walling et al.
patent: 5490999 (1996-02-01), Villagran et al.
patent: 5505982 (1996-04-01), Krawczyk et al.
patent: 5585135 (1996-12-01), Patterson et al.
Sackenheim Richard Joseph
Wong Vincent York-Leung
Bhat Nina
Clark Karen F.
Gressel Gerry S.
Jones Melody A.
The Procter & Gamble & Company
LandOfFree
Process for making flavored nut spreads having relatively high s does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process for making flavored nut spreads having relatively high s, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for making flavored nut spreads having relatively high s will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2122841