Process for improving adhesion of resist to gold

Details Process for improving adhesion of resist to gold Process for improving adhesion of resist to gold

1983-04-08

1985-02-05

Smith, John D.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Electron beam imaging

427 82, 427 96, 427240, 427409, 430318, 430319, 430327, 430942, 430967, H01L 21312

Patent

active

044978901

ABSTRACT:
A process is disclosed for improving the adhesion of a polymeric resist to a gold metallization surface. The process includes the use of a chelating silane as an adhesion promoter between the resist and the gold metallization surface. The improved resist adhesion to the gold metallization surface is attributed to a complexation or chemisorption mechanism. The adhesion promoters of interest contain moieties capable of acting as chelating or chemisorption sites on the molecular silane, thus creating layer-to-layer bonding with greater strength than that observed where just Van der Waals interactions occur to the gold surface atoms.

REFERENCES:
patent: 3482977 (1969-12-01), Baker
patent: 3549368 (1970-12-01), Collins
patent: 3911169 (1975-10-01), Lesaicherre
patent: 4075367 (1978-02-01), Galett
patent: 4371565 (1983-02-01), Baise

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