Process for fabricating an integrated circuit package

Details Process for fabricating an integrated circuit package Process for fabricating an integrated circuit package

2007-07-24

2007-07-24

Clarak, S. V. (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S111000

Reexamination Certificate

active

11137973

ABSTRACT:
A process for fabricating an integrated circuit package. At least a first side of a leadframe strip is selectively etched to define portions of a die attach pad and at least one row of contacts adjacent the die attach pad. A carrier strip is laminated to the first side of the leadframe strip and a second side of the leadframe strip is selectively etched to thereby define a remainder of the die attach pad and the at least one row of contacts. A semiconductor die is mounted to the die attach pad, on the second side of the leadframe strip and the semiconductor die is wire bonded to ones of the contacts. The second side of the leadframe strip is encapsulating, including the semiconductor die and wire bonds, in a molding material. The carrier strip is removed from the leadframe strip and the integrated circuit package is singulated from a remainder of the leadframe strip.

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Neil McLellan et al.; “Leadless Plastic Chip Carrier With Etch Back Pad Singulation”; U.S. Appl. No. 09/802,678, filed on Mar. 29, 2001; currently pending.
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