Process for etching high copper content aluminum films

Details Process for etching high copper content aluminum films Process for etching high copper content aluminum films

1992-12-10

1994-09-27

Quach, T. N.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156646, 156656, 437245, C23F 112

Patent

active

053504887

ABSTRACT:
Aluminum alloys containing high amounts of copper can be etched to eliminate copper residues using boron trichloride and chlorine under etch conditions of low temperature, low pressure, high power and strict control of the amount of nitrogen present.

REFERENCES:
patent: 4370196 (1983-01-01), Vossen, Jr. et al.
patent: 4798650 (1989-01-01), Nakamura et al.
patent: 4951601 (1990-08-01), Mayden et al.
patent: 4985113 (1991-01-01), Fujimoto et al.

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