Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Patent
1995-06-30
1998-01-27
Nguyen, Nam
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
20419212, 20419217, 20429811, C23C 1434
Patent
active
057118582
ABSTRACT:
An improved process for depositing a conductive thin film upon an integrated circuit substrate by collimated sputtering is disclosed. The sputtered films are alloys of aluminum; a preferred alloying metal is magnesium. The sputtered films of the invention have a more uniform orientation of grains than sputtered aluminum copper silicon alloy films. Such processes are especially useful in the fabrication of integrated circuit devices having aluminum alloy wiring elements.
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Kontra Richard Steven
Licata Thomas John
Ryan James Gardner
Sullivan Timothy Dooling
Crockatt Dale M.
International Business Machines - Corporation
Nguyen Nam
Soucar Steven J.
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